Renowned manufacturers of high-efficiency thermally conductive adhesives were looking for a technically more advanced solution that also offers higher economic efficiency. The new vacuum bonding process developed by Scheugenpflug AG has been designed to solve the aforementioned problems and fulfills all the requirements, including process safety. The results are perfect.

After applying the bead of adhesive to the heat sink surface and placing the PCB on the heat sink, the still unfinished assembly is introduced into a small vacuum chamber. The small size of the vacuum box (15x12x7 cm) allows evacuation and subsequent ventilation within fractions of a second.

During evacuation, air is removed completely, even the air trapped between the beads of adhesive, as well as all the air between the heat sink and board. When air is introduced afterwards, the instantly rising air pressure bonds the heat sink tightly and evenly to the surface of the PCB.

Inserting the assembly into the small vacuum chamber after dispensing the thermally conductive adhesives on the heat sink.

Transversal section of the assembly in the small vacuum chamber.

Transversal section of the assembly in the small vacuum chamber after the vacuum bonding.