Schedule

Halle/Hall:         7
Stand/Booth:    7419


More and more attention is being focused on industrial bonding technologies.

With their industry platform for industrial bonding technologies, namely BONDexpo, trade fair promoters P. E. Schall GmbH & Co. KG have succeeded in establishing a new type of “complementary trade fair” within a very short period of time. In the year 2012, the 6th BONDexpo will be held at the Stuttgart Exhibition Centre from the 8th through the 11th of October. It will present itself in the usual time-tested fashion concurrent to the 31st MOTEK, leading international trade fair for handling, assembly and automation technology, and will impressively document the necessity for looking beyond one’s own horizons in order to fully represent the production and assembly process sequences.

Enthusiastic Feedback for 5th BONDexpo in 2011

With more than 100 entirely satisfied exhibitors and overall exhibition floor space amounting to nearly 41,000 square feet, BONDexpo’s 5th anniversary event in the fall of 2011 verified that the trade fair has been very well accepted within the market and has established itself as a central industry showcase. Daniel Puric of Henkel AG & Co. KGaA explains: “The MOTEK-BONDexpo trade fair duo is proving to be an ideal combination. We’re seeing a good mixture of highly qualified old and new contacts, which together generate great potential for orders. International visitors were also well represented in 2011 [...] Every day saw really busy periods at our booth, which nearly pushed us to the limit.” As summarised by Daniel Sajko of tewipack Uhl GmbH: “BONDexpo is an ideal platform for our company and is this year’s trade fair par excellence.”

6th BONDexpo in 2012:
Trend-Setting Industry Meeting Place for Bonding Technology

Strong development demonstrated by BONDexpo during the course of just five events substantiates its importance for the industry, which will certainly increase in the future as well – especially in light of the fact that the issues involved with bonding and joining new materials represents a genuine challenge for adhesives technology both now and for the future as well. After all, lightweight construction isn’t just an issue for motor vehicles, but rather for equipment and devices in general as well. Future materials and material combinations, as well as hybrid solutions, will offer streamlining and resource potential which can only be taken advantage of through the use of new adhesives.

The 6th BONDexpo will mediate the state-of-the-art and current know-how in the areas of R&D, actual use and materials application, and will point out new directions for the future of bonding, insulation, foaming, sealing and encapsulation technologies.